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Tungnan University

Tungnan University

Department of Mechanical Engineering

Program Level
Language of instruction
Under 50% taught in English
Fall / Spring

The Department of Mechanical Engineering of Tungnan University, which was founded in 1970 and initially offered only a five-year junior college program, has evolved to provide four-year university education for senior high school graduates. The department has been rated among the "First Class" departments in the nation by Ministry of Education. In addition to the quest for excellence in research, the department also emphasizes teaching excellence with the objectives to help upgrading the mechanical engineering related industries in Taiwan, to develop precision manufacturing technologies, and to cultivate mechanical engineers who are proficient in product design, analysis and manufacturing, and in system integration and management skills. The department co-founded, with the Department of Mechanical Technology, the Institute of Mechanical offering a two-year program toward a Master of Science degree. To embrace the emerging nano-science and nano-technologies, the department launched a new undergraduate program in micro- and nano-technologies in the autumn of 2005. The core areas of the department include precision manufacturing technologies, micro- and nano-technologies, and computer aided engineering: Precision manufacturing technologies: to cultivate design and manufacturing engineers who are proficient in ultra-precision and micro machining, precision measurement, precision mold tooling, mold flow analysis, and reverse engineering technology. Micro- and nano-technologies: to
nurture advanced process engineers for semiconductor industry who are proficient in micro- and nano-measurement, thin film fabrication, material micro-structure analysis, micro-device vibration analysis, and MEMS technologies. Computer aided engineering: to cultivate design and analysis engineers who are proficient in computer aided design, computer aided manufacturing, product development and design, finite element analysis, and heat transfer analysis in microelectronics.


Contact information

Office of International Affairs